The Effect of Bath Temperature on the Chemical Bath Deposition of Copper Sulphide Thin Films

Abstract

Copper sulphide thin films were deposited onto indium tin oxide glass substrates at various bath temperatures by chemical bath deposition technique. XRD studies demonstrated that the thin films had hexagonal structure and confirmed the improvement of crystallinity of the films by increasing the bath temperature. Meanwhile, the surface roughness, film thickness and grain size were also increased with increasing of bath temperature from 25 to 45 °C.  However, the films deposited at 25 °C were uniform, smaller grain size and covered the substrate surface completely according to AFM images.Optical absorption analysis indicated that the band gap values were increased from 2.5 to 2.7 eV as the bath temperature was decreased from 45 to 25 °C.